The industrial applications supported by Industrial Solutions in the DLP Products Division of Texas Instruments (TI) have been demonstrated at the VisionChina2017 machine vision exhibition in Shanghai on March 14, BB0 and 16. Programmable DLP technology will be used in a variety of innovative solutions for 3D machine vision, 3D printing, spectral analysis, digital lithography and other fields.

DLP NIRSCAN Nano Near-Infrared Spectroscopy Evaluation Kit

3D holographic microscope based on DLP technology

DLP products support a wide range of chipset product libraries for 3D machine vision, 3D printing, spectral analysis, digital lithography and other innovative applications

"I feel very honored to be here again this year. "DLP is the proven leading MEMS technology of the last 20 years." Raecine Meza, Head of Industrial Products Marketing, TI DLP® Enterprise and Cinema Display. Raecine Meza is a Product Marketing Engineer for Texas Instruments' (TI) DLP® Enterprise and Cinema business, where she is responsible for bringing DLP products to more industrial applications. Her work includes expanding and developing business and marketing strategies for the growing DLP technology market to power a wide range of industrial applications -- including 3D scanning, 3D printing, optical sensing, and traditional display applications. Under her leadership, DLP chipsets were introduced to the mass market and she understood the needs of emerging applications, while she was responsible for evaluating new product concepts to drive the growth of the DLP Products Division business.

Raecine Meza, Head of Product Marketing

DLP products for industrial applications support high display rates, pixel precision processing and non-visible wavelengths. With a complete reference design and easy-to-use development tools, DLP products are accelerating the pace of innovation in the development of new products for industrial applications such as 3D scanning, including automated optical inspection (AOI), and near-infrared spectroscopy, including food safety testing.

By providing high-precision, high-speed, and reliable structured light displays, DLP technology helps the PCB industry achieve high-performance 3D AOI and solder paste inspection (SPI) solutions. These methods help to detect product defects early in the assembly process and, in addition, ensure the quality and reliability of the PCB manufacturing process at a lower manufacturing cost when used in combination with the final inspection program.

With the DLP NirScan ™ Nano evaluation module, designers are able to develop systems for food quality analysis and control. This compact, battery-powered development kit for portable near-infrared spectroscopy analysis and sensing solutions provides a non-invasive tool for food and agricultural analysis.

Application of true 3D display based on DLP technology

The media visit

At the show, TI will present a number of powerful demos, including:

1. 3D machine vision solution based on DLP4500 chip set;

2.DLP NIRSCAN ™ Nano Near-Infrared Spectrometer Evaluation Kit;

3. High performance and high flexibility DLP Discovery™ 4100 evaluation board;

4. Productable optical modules for 3D machine VISION and 3D printing developed by Shenzhen Anwar Optoelectronics Technology Co., Ltd and In-Vision ® Digital Imaging Optics GmbH;

5. Mass production NIR spectrometer module developed by Yangguang Green Energy Co., Ltd.;

6. Innovative 3D holographic biological cell microscope developed by TomoCube Inc.