Discover the Invisible with VS-TCM1-65CO/S-RIR Telecentric Lens

VS Technology introduces the VS-TCM1-65CO/S-RIR telecentric lens, capable of imaging from the visible spectrum to 1200nm without focus shifting. SWIR imaging penetrates materials like silicon and resin, revealing contents, moisture, and imperceptible damage. Ideal for wafer inspection, it maintains clear focus while changing wavelengths. Key specs include 1.0x magnification, 65mm working distance, and C-Mount. Explore the microscopic world and enhance inspection accuracy. Scan to learn more about our SWIR products.Follow us on WeChat and visit our website for updates.