Defects are detected by the process of bonding the drive chips into the LCD panel.
It uses undifferentiated light to capture the shadow of the conductive ball, making it appear three-dimensional.
An optical system that can check the crimp position, the density of the conductive balls, and the strength of the indentation during the post-bonding process and die alignment of the LCD.
Measure conductive ball indentations down to the micron scale using a line scan camera and high power illumination.