Defect inspection: foreign objects, pores, depressions, cracks, color, white spots, cutting defects, chipped edges, stains, and cracks.
Equipment features:

1. Automatic material loading and unloading, stacking 240-300 epi-wafer rings in one go, to meet the continuous inspection needs for 6-8 hours;

2. Compatible with 4-inch to 7-inch epi-wafer rings, capable of inspecting grains as fine as 10 microns;

3. Inspection speed: 12 pieces per hour for a 7-inch epi-wafer ring with 15,000 grains;

4. Inkjet marking, defective grains can be inspected and marked immediately, NG point marking speed exceeds 10k/UPH;

5. Automatic MAP map generation for defective products, for easy subsequent addressing.